The ultrasoft silicone sponge is characterized by a low Young's modulus (0.01 MPa) and low thermal conductivity (0.08 W m −1 K −1) owing to its open-cell structure. This study presents and explores the improvements enabled by an ultrasoft silicone sponge encapsulation for S-TEGs using silicone-encapsulated serpentine interconnects for the internal electrical wiring of the bismuth-telluride-based thermoelectric elements. An approach that improves both stretchability and thermoelectric performance is required. However, their thermoelectric performances are still lower than those of conventional hard and rigid TEGs and are easily degraded by large or cyclic deformations due to electrical failure. Stretchable thermoelectric generators (S-TEGs) have the potential to utilize waste heat from sources with complex and dynamic surfaces.
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